Surface finishing and plating apparatus

ABSTRACT

This specification discloses an apparatus for plating a surface wherein a conductive anode body is spaced from a cathodic work surface by non-conductive particles carried in the anode body. The non-conductive particles closely space the anode from the cathodic surface, activate the cathodic surface to increase the plating rate, and may be utilized to carry out a honing or burnishing operation on the work surface.

United States Patent Watts Mar. 18, 1975 [54] SURFACE FINISHING ANDPLATING 3,022,232 2/1962 Bailey et al. 204/DlG. l0 APPARATUS 3,334,0418/1967 Dyer et al. 204/284 3,377,264 3/1968 Duke et al. 204/DIG. 10Inventor: J Watts, 2 Mohawk 3,619,401 11/1971 Eisner 204/o1o. 10Clinton, Conn. 06413 3,706,650 12/1972 Eisner .l 204/217 [22] Flled'July 1972 Primary E.\'aminerF. C. Edmundson [21] Appl. No.: 276,882Attorney, Agent, or Firm DeLio & Montgomery 52 11.5. C1 204/209, 204/33R, 204/129.46, [57] ABSTRACT 204/206, 204/DIG. 10, 204/224 R, 204/224 MThis specification discloses an apparatus for plating a 511 1111.01(1231) 5/72, BOlk 3/04 surface wherein a Conductive anode y is Spaced 58Field of Search 204/DIG. 10, 209, 224 M, from a cathodic work surface ynon-conductive P 204/206 2()8 224 R cles carried in the anode body. Thenon-conductive particles closely space the anode from the cathodic [56]Refe en e Ci d surface, activate the cathodic surface to increase theUNITED STATES PATENTS plating rate, and may be utilized to carry out ahoning l 545 7/1925 Conn 204mm 10 or burnishing operation on the worksurface. 2,997,437 8/1961 Whitaker 204/209 18 Claims, 7 Drawing FiguresPOWER SUPPLY SURFACE FINISHING AND PLATING APPARATUS This inventionrelates to surface finishing apparatus and method, and more particularlyrelates to an apparatus operating upon a surface to apply a platingthereon.

Plating of a surface has customarily been accomplished by immersing thesurface to be plated in an electrolyte and establishing an electricalpotential between the workpiece and an electrode to produce migration ofthe plating ions in the solution to the workpiece and subsequent platingout thereon. As described above, this is a fairly time consumingprocess.

Recently, higher plating rates have been achieved by rubbing or abradingthe electro deposit surface during the plating operation. Varioustheories for this phenomena have been expressed. One is that the electrodeposit surface is activated to generate surface defect sites bymechanically distorting the crystal lattice of the metal deposited.Another is the decrease in a stagnant polarization layer overlying thecathodic surface. Generally speaking, the object of this activation ofthe surface is to increase the current density between the anode and thecathodic surface, resulting in a more rapid rate of deposition of theplating.

lt has been proposed to burnish or bone a surface and provide platingthereon simultaneously or in the same overall process. One recentlypublicized technique in this area utilizes a procedure of mechanicalabrading or honing to clean the metallic surface of a workpiece, with anarbor carrying abrading stones. Then the arbor is charged with anelectrical potential opposite to a potential placed on the workpiece andan electrolytic solution is flooded between the arbor and the workpiece.This will result in metal plate onto the surface at a rate depending onthe solution being used, the current density, and other well knownparameters. In this method, the honing stones may be maintained in a lowpressure state while the plating is occurring to attempt to eliminatetreeing of the plating particles.

The technique as described above decreases the time required forplating. However, certain difficulties are presented in this process.The elongated arbor carrying the honing elements generally extendsbeyond both ends of the bore and results in a plating buildup beyond theend of the bore. Additionally, it has been determined that the arboritself deplates due to the potential thereon.

It has also been proposed to mechanically activate the entire surface ofa workpiece with a nonconductive matrix carried on a moving anode acrossthe cathodic work surface. This technique is stated to substantiallyincrease the plating current density and thereby decrease the platingtime. This technique, however, requires that the entire surface of theworkpiece be activated. Additionally, the positioning of thenonconductive matrix between the anode and the workpiece increases thespacing therebetween.

Another technique suggests the use of a movable device which movesbetween the anode and cathode while activating the cathode surface andacting as a transfer device for ions between the anode and cathode. Thisobviously requires additional mechanism, complete immersion of theworkpiece in the electro lyte, and/or anodes of a size substantiallygreater than the surface to be plated.

While the foregoing techniques have been effective to increase thecurrent density between anode and cathode, they have certainlimitations. They require large anode areas, or ion transfer mechanismswhich are greater than the surface area to be plated. This may result inan over-abundance of throwing power and resultant inability to apply adiscrete electro deposit within predetermined areas.

Accordingly, the present invention provides a new and improved apparatusand method for depositing a plating material on a cathodic surface inwhich the plating area as well as the plating thickness may be veryprecisely controlled. The invention further requires only simplifiedapparatus in the practice thereof.

In the present invention, in one form thereof, nonconductive particlesare distributed through and held in a conductive body, and thenon-condutive particles are moved over the cathodic surface to provideactivation thereof while positive potential is applied to the conductivebody. Besides providing the necessarily hard activating particles andalso acting as a bone, if desired, the non-conductive particles permitvery close spacing of the anode to the cathode, resulting in highercurrent densities and further providing a more uniform current fielddistribution between the anode and cathode.

The invention further provides means for controlling the pressure of thenon-conductive particles on the cathodic surface and provide both asurface finishing action, under higher presure, and a lighter pressurewhen the non-conductive particles are only serving to activate thecathodic surface.

The use of the non-conductive particles bound in the conductive body,which serves as the anode, provides a further advantage in localizingthe area of plating on a cathodic surface in that the field between theanode and the cathode is localized to the area of the cathode positionednext to the anode and there will be little, if any, tendency to plateoutside of the geometrical limits of the anode of the area adjacent thepath of movement thereof.

The dimension of the tool is made lesser than the correspondingdimension of the workpiece so that the quality or evenness of platingthroughout the length of the workpiece may be better controlled throughcontrol of movement of the tools. During a plating operation, thenon-conductive particles of the tools are allowed to provide a veryminor rubbing action on the surface. This tends to prevent theobjectionable treeing and further is believed to produce a uniformorientation of the ionic plating particles to provide a more adherentbond of the plate to the substrate.

To control the spacing between the anode and the cathode, the anodematerial may be chosen to deplate or disintegrate at a rate proportionalto wear on the non-conductive particles.

An object of this invention is to provide a new and improved apparatusand method for finishing the surface of a workpiece.

Another object of this invention is to provide a new and improved methodfor plating the surface of a workpiece or a predetermined portionthereof in which the plating area may be very closely controlled.

A further object of the invention is to provide an operation forfinishing and/or plating the surface of a workpiece which decreases theoperational time required and provides a bond between the plating andthe base metal which is as strong as the metals themselves.

A further object of this invention is to provide an apparatus forcoating the surface of a workpiece in which the spacing between theanode and cathode surface may be very closely controlled.

The feature of the invention which are believed to be novel areparticularly pointed out and distinctly claimed in the concludingportion of the specification. The invention, however, both as to itsorganization, operation, apparatus and practice thereof, together withfurther objects and advantages thereof may best be appreciated byreferring to the following detailed description taken in conjunctionwith the drawings wherein:

FIG. 1 is an elevation in half section of an apparatus utilized in thepractice of the invention;

FIG. 2 is a view seen in the plane of lines 22 of FIG. 1'.

FIG. 3 is an enlarged view of a portion of FIG. 1;

FIGS. 4 and 5 are schematic fluid and electrical diagrams exemplifyingcontrol of movements of the device of FIG. 1;

FIG. 6 is a side elevation of another device for practicing theinvention, and

FIG. 7 is a view seen in the plane oflines 77 of FIG. 6.

As exemplified in FIG. 1, the invention may be embodied in an apparatus10 adapted to finish and plate the cylindrical bore 12 of a workpiece13. Acting on the bore 12 is a plurality of shoes or tools 14 comprisinggrains or particles of a non-conductive material uniformly distributedand bound together in a conductive body material. The tools 14 arecarried in nonconductive holders or carriers 15 having tapered rearsurfaces. The non-conductive particles may be aluminum oxide or othermaterials as hereinafter described.

The tools 14 are adapted to engage the surface bore 12 and wipe oractivate the surface which is cathodic while a positive potential isapplied to the conductive tool bodies as hereinafter described.

Apparatus 10 further comprises a housing member 16 having an upperportion 16a and a lower portion 16b. A shaft 17 is rotatably mounted inhousing 10 and is adapted to be driven by a motor 18 with a pinion 19 onthe shaft thereof engaging a spline-like gear 20 on shaft 17. Thisconnection permits vertical movement of shaft 17 with respect to gear20. Shaft 17 extends through a wall 21 carrying a bearing seal 22 intothe lower portion 16b of the housing member and has integral therewithor attached thereto a piston 23 which, together with wall 21 defines acylinder or chamber 24.

A piston member 26 is coaxial about shaft 17 and non-rotatably mountedthereto as by means of a key 27. Shaft 17 in piston member 26 extendscoaxially through a bottom wall 28 and a bearing seal 29. Wall 28together with piston portion 30 of member 26 define a cylinder orchamber 31.

As hereinafter described, the various parts may be actuated eitherpneumatically or hydraulically. A fluid conduit 32 extends to a port 33in housing portion 16b to communicate with chamber 24. A fluid conduit34 also extends through housing 16b at a port 35 to providecommunication to the inside of chamber 31. A passage 36 extendinglongitudinally of shaft 17 communicates through a port 37 with chamber25 and at the upper end of shaft 17 is in communication with a suitablysealed fluid conduit 38. Extending radially outwardly from member 26below wall 28 is a pressure member 40 having a tapered peripheralsurface 41 adapted to act on tapered carriers 15. A second pressuremember 42 extends radially from the end of shaft 17 and has taperedsurface 43 also engaging the tapered surface of holders 15. Thus whenthe member 40 is moved downwardly toward member 42 as by increasing thepressure in chamber 25 due to delivery of fluid through passage 36 andport 37 the tapered surfaces 41 and 43 acting on the tapered holders 15force the shoes 14 outwardly toward contact with cylindrical bore 12 toincrease the pressure of the bodies 14 on the surface 12. The bodies 14may be moved downwardly with respect to bore 12 by increasing thepressure in chamber 24 and simultaneously decreasing the pressure inchamber 31. The bodies 14 are moved upwardly by increasing the pressurein chamber 31 while decreasing the pressure in chamber 24. The members40 and 42 thus provide a means for increasing the pressure of thenon-conductive particles of the anode boides on the cathodic surface.

As these pressure changes are alternated, the bodies 14 may bereciprocated within the confines of bore 12. Simultaneously with suchreciprocation, the bodies 14 may be rotationally moved by motor 18acting through pinion 19 on gear 20 on shaft 17. With this arrangement,the bodies 14 may have both revolving and reciprocatory motion impartedthereto. Electrical power is delivered to bodies 14 through an insulatedconductor 45 extending a passage or bore 45a in shaft 17 and connectedto the bodies 14 as hereinafter described. Electrical power may beapplied to conductor 45 through a lead 46 extending through housingportion 164: to one or more brushes 47 bearing on a conductive ringabout shaft 17 and suitably insulated therefrom. Leads 45b are taken toconductor or conductors 45. This slip-ring arrangement is containedwithn a housing 50 nonrotatably disposed with respect to shaft 17 andmounted for vertical movement on a support member 50a extending from theinner side wall of housing portion 16a.

For reasons hereinafter made apparent, the housing 16, the portion ofshaft 17 extending therefrom, and pressure members 40 and 42 have anelectrical insulating surface coating which may comprise a layer of apolyethylene or polypropylene. The purpose of such insulating layer isto prevent any anodic or cathodic action on or by these parts.

The conductors 45 are brought passage 54 and connected to bodies 14 inany suitable manner. For example, the conductors 45 may be connected tofemale connectors 48 carried in any insulating block or collar 48adisposed about shaft 17 just member 42, as more clearly seen in FIG. 1.The connectors 48 receive a male connector 48b carried by an insulatingterminal member 49 received in a recess 51 in collar 48a. A flexibleinsulated connector 51a suitably extends into an insulating terminal 52which engages a conductive member 53 in carrier 15 and body 14 tocomplete an electrical connection to the conductive body 14. If desired,the conductor 53 may have a headed or flanged end to increase the areaof contact with the material of body 14. The lower end of shaft 17 hasradial passages 54 therein for leading the conductors 45 to terminals48b. The connection between the insulating terminal members 52 and 49 isby a somewhat flexible cable or conductor 51 to permit inward andoutward movement of the bodies 14.

With the arrangment described, the connecting portion may bedisconnected both from terminal 49 and the terminal 52 in body14I-and/or the conductor 53 in body 14 to permit replacement of the bodyas desired. The holders may be provided with an eye 55 thereon throughwhich extends an annular resilient strip 56 which acts as a retainer onthe body 14 but which permits radial outward movement of the bodies 14due to pressure exerted thereon by members 40 and 42. Strip 56 willpermit outward movement of bodies 14 due to centrifugal force so thatthe surfaces 58 thereof may ride lightly on the bore 12 of workpiece 13without the application of positive pressure. Strip 56 has sufficientresiliency to retract bodies 14 when a cycle of operation is completeand allow removal of the bodies from bore 12. The housing member 16 maybe mounted to a column or to a pair of vertical guides (not shown) forvertical positioning.

The workpiece 13 is carried on a support member 60 within a receptacle61. Support 60 is suitably insulated or formed of a material which willnot be subject to electrolytic action. An electrolyte is moved upwardlythrough bore 12 under pressure from pump 62 to flood the space betweenbodies 14 and bore 12. As the electrolyte overflows bore 12 it isretained in receptacle 61 and recycled by pump 62. Any suitabletechnique may be utilized to supply the electrolyte between the anodebodies 14 and bore 12. The foregoing technique is merely exemplary.

The bodies 14 (FIG. 3) are composed of nonconductive particles 70uniformly dispersed and distributed through the conductive body material71. The particles 70 may have a multiple function. They serve to spacethe anode, body material 71 from the work surface 12, act as honingstones, to finish surface 12, and also mechanically activate the surface12 and any plating deposit thereon.

The size of the particles is preferably 50 to 80 mesh grit for mostapplications. This could provide a cathode to anode spacing of 0.0005inch to 0.050 inch plus. Where the surface 12 is unusually rough alarger size particle may be used to increase the spacing between anodeand cathode. The particle size may also vary outside of the foregoingrange dependent on the particular application and whether more or lessabrading is desired, and the roughness of the surface to be plated.

The bodies 14 may be copper containing 25 75 percent by volume ofaluminum oxide particles which are stirred into a copper in a moltenstate to achieve uniform distribution, and cast into the shape shown.Other solid metals as well as alloys thereof may form the anode bodies14 as hereinafter explained.

Another body composition may be formed from a wet slurry of carbonparticles and aluminum oxide particles which are stirred, as byvibration, while subjected to heat. The resulting mixture is dried intoa hard dry body 14 comprising uniformly distributed nonconductingabrasive particles in the conductive body.

In this construction, the surface carbon would tend to break down as thenon-conductive particles were and dropped out of the body. This wouldmaintain the spacing between the anode body and the work surface.

In the first-mentioned constructions where the body is a cast metal, anunobvious use is made ofa normally undesirable problem. Normally, inabrasive plating, as mention in the introductory portion of thisspecification, the anode deplates or deteriorates and may change thespacing with respect to the cathodic surface. However, in the presentinvention, the anode material is selected so that if it is subject todeplating, it will deplate or disintegrate at a controlled rateproportional to wear of the non-conductive spacing particles.

Therefore, the anode metal, and/or alloys thereof, is selected withrespect to the type of plate according to the properties of the metaland the electromotive series. For example, a titanium oxide would beused for gold plate. The oxides of titanium are very resistant todeplating and more noble than silver in the electromotive series. Nickelcould be used as the anode in plating copper; cobalt for plating nickel;steel for plating cadmium; aluminum alloys for plating zinc or chrome.

In some instances a semi-conductor such as silicon carbide may be usedfor the particles 70. Because of the relatively low voltage appliedacross the electrodes, such particles would act as non-conductors orsemiconductors for special effect plating.

In the embodiment thus far exemplified, there will be a cyclicapplication of the positive anode potential as bodies 14 rotate past agiven area on the walls 12 of the bore. This effect provides a tighterbond between the plate and the base metal. This is believed to be due tothe moving anode orienting and re-orienting the plating ions to uniformpositions on the surface of the work.

It is apparent that the area of the moving anodes is less than the areaof the surface to be plated. Thus, plating can be more accuratelycontrolled to the area adjacent the anodes. Due to this relationshipthere will be no overruns of plating material at the ends of the bores,or outside of the boundaries of the anodes.

FIG. 4 exemplifies a basic diagram for controlling vertical movement ofthe anode bodies 14 of the apparatus of FIG. 1. A hydraulic system 74comprises a fluid reservoir 75, a pump 76 supplying fluid under pressureto a line a and a pressure relief or regulating valve 77, connectedbetween pressure line 75a and return line 78. Line 750 may be connectedto chambers 25 or 31 through their respective ports 33 and 35 by afourway valve 79 operated by solenoids 80 and 81. If solenoid 80 isactuated, as by closing switch 82, line 75 is connected to chamber 24through port 33 and chamber 31 is connected to return line 78. This willproduce downward movementof bodies 14 while shaft 19 is rotated.

To move bodies 14 upwardly, solenoid 81 is energized by closing switch84 and the connections of lines 75a and 78 to ports 33 and 35 arereversed. Solenoids 80 and 81 are interlocked through relays RD and RUas shown in FIG. 5. Each of relays is in parallel with one solenoid andhas a normally closed contact in series with the other.

Fluid pressure is applied to chamber 25 through line 85 and two-way 86when a switch 87 is closed to energize valve-solenoid 88. A variablepressure regulator valve 89 is connected across valve 86 to establish apredetermined pressure in chamber 25 and, hence, control the pressure ofbodies 14 on wall 12. Valve 89 will be set so that the pressure inchamber 25 is no less than the pressure in one of chambers 24 or 31during vertical movement. Pressure in chamber 25 may be reduced for aplating operation by lowering the setting of valve 89.

For automatic operation, the switches 82' and 84 may be provided tooperate as reversing limit switches within housing 16a on member 50 andoperated by positionable dogs (not shown) in housing 16a. The positionof the switches and dogs will determine the dimension of verticaltravel.

The fluid control circuit exemplified in FIG. 4 may include variousthrottling and flow control devices to predetermine the rate of verticalmovement, and reciprocation of bodies 14.

In operation, shaft 17 is rotated by motor 18. If no pressure is appliedto member 15, the bodies 14 will move outwardly due to centrifugal forceand rub lightly on the cathodic surface to produce mechanical acitvationthereof. For plating purposes a positive potential is applied to lead 46and a negative potential applied to the workpiece from a power supplyexemplified as PS, FIG. 1.

Where a finishing operation is desired, hydraulic fluid is introducedthrough line 38 to chamber 25, piston member 26 is urged downwardly andbodies 14 urged outwardly until a predetermined pressure is establishedbetween the bodies 14 and bore 12. Then a honing or finishing operationmay be performed, either before or after a plating cycle.

The foregoing FIGS. 4 and 5 are intended only to exemplify control ofthe movements of the anode bodies. In a production set-up, as forrepetitive operation on the same type of workpieces, programmedautomatic cycling controls of a suitable type may be employed.

The invention may also be practiced in other forms. FIGS. 6 and 7exemplify apparatus and techniques for plating a small portion of asubstrate. such an application might include plating small areas of goldon copper electrical contacts.

An endless belt 90 comprising apart flexible members 91 and 92 with thespacing spanned by a conductor 93 is provided. One surface of the beltis covered by a layer of conductive material 94 bonded to members 91, 92and 93. The material includes nonconductive hard particles which closelyspace the conductive body from a cathodic workpiece 95.

The belt 90 is passed non-conductive idler rolls or shafts 96, 97, 98and 99 which may be adjustable to tension belt 90, and to change theoutline defined by the belt. Roll 99 is driven by a motor M to move belt90 over a particular portion of workpiece 95. The close proximity of theanode belt to the cathodic surface permits greater control of theelectro deposit on a local or selected area D with no deleterious fringeeffects at'the edges. The anode belt is connected to a positivepotential through a brush 100 bearing on conductor 93, or other suitablecoupling device.

The belt, as shown, comprises flexible backing members together with aconductive strip covered by a conductive material with thenon-conductive abrasive members therein.

The belt may also be formed ofa conductive ionomer plastic. A zinc orsodium substituted radical of polyethylene may be comminuted, mixed withother conductive particles such as graphite, aluminum, copper, etc. andthe non-conductive particles, heated and extruded into belt form. Ifdesired, glass fibers may be included in the blend to impart strengthand control the degree of flexibility. In such cases the conductivestrip 93 may not be required. A suitable ionomer is one sold under thetrademark Surlyn by E. l. DuPont DeNemours Company.

The belt may also be constructed from woven meal fibers, such astitanium or copper, impregnated with conductive material andnon-conductive particles. The belt may also be constructed of a wovennon-metal fiber impregnated with a mixture of conductive andnon-conductive particles, then calendered or otherwise formed.

In most cases, the belt need be no thicker than A inch to 3/8 inch. Thisdimension will permit sufficient flexibility of the belt.

A platen 101 is provided to control the pressure of the belt on theworkpiece. Platen 101 may be controlled by one or more hydraulic orpneumatic cyclinders (not shown) to vary the pressure on the workpiece.

The anode bodies may take many different geometrical shapes depending onthe surface to be finished or plated. For a flat surface, a horizontalor wheel may be provided. A bore may also be plated through use of arotating anode which is also revolved about the axis of the bore. Insuch applications, the electrolyte may be directed at the areas ofcontact of the anode tool on the work'surface by one or more nozzles.

The non-conductive particles in the anode bodies 14 or the belt 90 orother anode tool may have a selected hardness which is determined by thebreakdown or deplating rate of the conductive body material, and if agrinding or honing operation is desired, either before or after plating.Generally, the plating rate will be enhanced with softer, finernon-conductive abrasive par ticles. Other'determining considerations arethe degree of hardness of the applied plating material, plating rate,and surface finish desired.

The close, uniform spacing of the anode to cathode over the area to beplated is an important feature of the invention. Theoretically, suchspacing could be as small as one molecule. However, a range of 0.040inch for plating on relatively rough finished surfaces to as little as0.0005 inch is the preferred range. This decreases the flow path betweenanode and cathode and permits the plating ions to adhere to the cathodicsurface before any physical changes such as oxidation or dissipation ofstatic charges occur. It also eliminates the undesirable treeing effectand tends to uniformly orient the plating ions on the cathodic surface.This provides a more adherent band of the ions to the cathodic surface.

In all cases the electrolyte contains the ions of the metal to be platedon the substrate of dissimilar metal. The moving anode bodiescontinuously move a fresh supply of ions the surface to be plated.

It may thus be seen that the objects of the invention set forth as wellas those made apparent from the fore going disclosure are efficientlyattained. Modifications to the disclosed embodiments of the invention aswell as other embodiments thereof may occur to others skilled in theart. Accordingly, the appended claims are intended to cover allmodifications to the disclosed embodiments as well as other embodimentsthereof which do not depart from the spirit and scope of the invention.

What is claimed is:

1. Apparatus for operating upon the surface of a workpiece comprising ananode tool having a plurality of non-conductive particles bound in anduniformly distributed through at least one electrically conductive body,means for moving said tool with respect to the surface of a workpiecesuch that the non-conductive particles engage said surface, and spacesaid surface from said conductive body, means supplying an electrolyticsolution between said body and the surface, and means for applying apositive electric potential to said body with respect to an electricalpotential applied to said workpiece.

2. The apparatus of claim 1 wherein said body is in the form of anendless belt.

3. The apparatus of claim 1 further including means for moving said toolinto and out of engagement with a workpiece.

4. The apparatus of claim 1 wherein a plurality of said bodies arecarried in angularly spaced relation on a rotatable shaft, means forrotating said shaft, means for moving said bodies radially with respectto said shaft to increase the pressure between said bodies and theworkpiece.

5. The apparatus of claim 1 further including means for increasing thepressure between said body and the workpiece.

6. The apparatus of claim 1 wherein said particles space said body from0.0005 inch to 0.040 inch from the workpiece.

7. The apparatus of claim 1 wherein said body has an area engaging theworkpiece which is less than the area of the workpiece.

8. The apparatus of claim 2 further including means for varying thepressure of said belt on the workpiece.

9. The apparatus of claim 1 wherein said at least one body is solid andof predetermined configuration, and said particles are relatively hardwith respect to the workpiece.

10. The apparatus of claim 9 wherein said body is in the form of anendless belt.

11. The apparatus of claim 1 wherein said particles are hard relative tothe workpiece.

12. The apparatus of claim 1 wherein the material of said bodyd isselected of a material which deplates during electroplating of theworkpiece at a rate proportional to wear of said particles.

13. The apparatus of claim 12 wherein said particles space theconductive surface of said body from 0.0005 inch to 0.040 inch from thesurface of the workpiece.

14. The apparatus of claim 19 wherein the material of said body isselected of a material which deplates during electroplating of theworkpiece at a rate proportional to wear of said particles.

15. Apparatus for operating upon and plating the surface of a workpiececomprising an anode tool having a conductive body with a multiplicity ofnon-conductive particles bound in and uniformly distributed through saidbody, the material of said anode selected with respect to the workpiecesuch that as said particles wear and said anode dissolves duringelectrolytic plating the particles maintain a substantially constantspacing between said body and the workpiece, means for moving said bodywith respect to the surface of a workpiece such that the non-conductiveparticles engage said surface and space said surface from saidconductive body, means supplying electrolytic solution between said bodyand the surface, and means for applying a positive electrical potentialwith respect to an electrical potential applied to said workpiece.

16. The apparatus of claim 15 wherein said particles space said bodyfrom 0.0005 inch to 0.040 inch from the surface of the workpiece.

17. The apparatus of claim 15 wherein said body is solid and ofpredetermined configuration.

18. The apparatus of claim 17 wherein said body is in the form of anendless belt of finite thickness and said particles are distributed inand through said belt with some of said particles being wholly withinthe surfaces of said belt mg? 1 UNITED STATES PATENT orrzcr.

CER'HFICATE OF CORRECTIGN Patent No. 3, 871, 983 Dated March 18, 1975Inv'entor(s) John D. Watts It is certified that error appears in theabove-identified patent and that said Letters Patent are herebycorrected as shown below:

Column 1 line 61 before "surface" change "cathode" to cathodic Column 2,line 21, "bone" should be hone Column 4, line 18, "boides" should bebodies Column 4, line 28, after "extending" insert through Column- 4,line 35, "withn" should be H within Column 4, line 62, before "therein"insert defined Column 5, line 66, "mention" should be mentioned Column6, line 9, after "oxide" insert anode Column 6, line 55, after "two-way"insert valve Column 7, line 33, before "apart" insert spaced Column 7,line 40, after "passed" insert over Column 7, line 66, "meal" should bemetal Column 8, line 16,-after "horizontal" insert disc Column 8, line49, after "ions" insert along Column 9, line 37, "bodyd" should be bodyColumn 10, line 6, "19" should be 9 Signed and, sealed this 17th day ofJune 1975.

- (SEAL) I Attest:

C. MARSHALL DANN RUTH C. MASON Commissioner of Patents- AttestingOfficer and Trademarks

1. Apparatus for operating upon the surface of a workpiece comprising ananode tool having a plurality of non-conductive particles bound in anduniformly distributed through at least one electrically conductive body,means for moving said tool with respect to the surface of a workpiecesuch that the nonconductive particles engage said surface, and spacesaid surface from said conductive body, means supplying an electrolyticsolution between said body and the surface, and means for applying apositive electric potential to said body with respect to an electricalpotential applied to said workpiece.
 2. The apparatus of claim 1 whereinsaid body is in the form of an endless belt.
 3. The apparatus of claim 1further including means for moving said tool into and out of engagementwith a workpiece.
 4. The apparatus of claim 1 wherein a plurality ofsaid bodies are carried in angularly spaced relation on a rotatableshaft, means for rotating said shaft, means for moving said bodiesradially with respect to said shaft to increase the pressure betweensaid bodies and the workpiece.
 5. The apparatus of claim 1 furtherincluding means for increasing the pressure between said body and theworkpiece.
 6. The apparatus of claim 1 wherein said particles space saidbody from 0.0005 inch to 0.040 inch from the workpiece.
 7. The apparatusof claim 1 wherein said body has an area engaging the workpiece which isless than the area of the workpiece.
 8. The apparatus of claim 2 furtherincluding means for varying the pressure of said belt on the workpiece.9. The apparatus of claim 1 wherein said at least one body is solid andof predetermined configuration, and said particles are relatively hardwith respect to the workpiece.
 10. The apparatus of claim 9 wherein saidbody is in the form of an endless belt.
 11. The apparatus of claim 1wherein said particles are hard relative to the workpiece.
 12. Theapparatus of claim 1 wherein the material of said bodyd is selected of amaterial which deplates during electroplating of the workpiece at a rateproportional to wear of said particles.
 13. The apparatus of claim 12wherein said particles space the conductive surface of said body from0.0005 inch to 0.040 inch from the surface of the workpiece.
 14. Theapparatus of claim 19 wherein the material of said body is selected of amaterial which deplates during electroplating of the workpiece at a rateproportional to wear of said particles.
 15. Apparatus for operating uponand plating the surface of a workpiece comprising an anode tool having aconductive body with a multiplicity of non-conductive particles bound inand uniformly distributed through said body, the material of said anodeselected with respect to the workpiece such that as said particles wearand said anode dissolves during electrolytic plating the particlesmaintain a substantially constant spacing between said body and theworkpiece, means for moving said body with respect to the surface of aworkpiece such that the non-conductive particles engage said surface andspace said surface from said conductive body, means supplyingelectrolytic solution between said body and the surface, and means forapplying a positive electrical potential with respect to an electricalpotential applied to said workpiece.
 16. The apparatus of claim 15wherein said particles space said body from 0.0005 inch to 0.040 inchfrom the surface of the workpiece.
 17. The apparatus of claim 15 whereinsaid body is solid and of predetermined configuration.
 18. The apparatusof claim 17 wherein said body is in the form of an endless belt offinite thickness and said particles are distributed in and through saidbelt with some of said particles being wholly within the surfaces ofsaid belt